ISL54205AIRZ-T
vs
ISL54205AIRZ
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INTERSIL CORP
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
DFN, uTQFN
|
SON
|
| Package Description |
HVSON, SOLCC10,.12,20
|
HVSON,
|
| Pin Count |
10, 10
|
10
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Analog IC - Other Type |
SPDT
|
SPDT
|
| JESD-30 Code |
S-PDSO-N10
|
S-PDSO-N10
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
2
|
2
|
| Number of Channels |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
10
|
10
|
| On-state Resistance Match-Nom |
0.02 Ω
|
0.02 Ω
|
| On-state Resistance-Max (Ron) |
5.5 Ω
|
5.5 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC10,.12,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
48 ns
|
48 ns
|
| Switch-on Time-Max |
67 ns
|
67 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
|
|
|