ISO103
vs
ISO256P
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
BURR-BROWN CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
0.600 INCH, SIDE BRAZED, HYBRID, CERAMIC, DIP-24/16
|
DIP, DIP28,.6
|
| Pin Count |
24
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Amplifier Type |
ISOLATION AMPLIFIER
|
ISOLATION AMPLIFIER
|
| Bandwidth (3dB)-Nom |
20 MHz
|
0.007 MHz
|
| Common Mode Voltage-Max |
1500 V
|
1500 V
|
| Isolation Voltage-Min |
1500 V
|
1500 V
|
| JESD-30 Code |
R-CDIP-T16
|
R-PDMA-T16
|
| Length |
31.05 mm
|
|
| Neg Supply Voltage Limit-Max |
-18 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16/24,.6
|
DIP28,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
9.52 mm
|
|
| Supply Current-Max |
90 mA
|
55 mA
|
| Supply Voltage Limit-Max |
18 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
HYBRID
|
HYBRID
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
15.24 mm
|
|
| Base Number Matches |
4
|
1
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare ISO103 with alternatives
Compare ISO256P with alternatives