JAN1N3026B vs BZV85-C18,133 feature comparison

JAN1N3026B Motorola Mobility LLC

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BZV85-C18,133 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Package Description O-MALF-W2 ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection CATHODE ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-13 DO-41
JESD-30 Code O-MALF-W2 O-LALF-W2
Knee Impedance-Max 750 Ω
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 200 °C
Operating Temperature-Min -65 °C
Package Body Material METAL GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Not Qualified
Reference Voltage-Nom 18 V 18 V
Reverse Current-Max 0.5 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 14 mA 15 mA
Base Number Matches 4 2
Rohs Code Yes
Part Package Code DO-4
Pin Count 2
Manufacturer Package Code SOD66
Factory Lead Time 4 Weeks
Dynamic Impedance-Max 20 Ω
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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