JAN1N3890R
vs
1N3890RE3
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
DO-4, 1 PIN
|
DO-4, 1 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| Application |
FAST RECOVERY
|
FAST RECOVERY
|
| Case Connection |
ANODE
|
ANODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JEDEC-95 Code |
DO-203AA
|
DO-203AA
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| JESD-609 Code |
e0
|
e3
|
| Non-rep Pk Forward Current-Max |
175 A
|
175 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Output Current-Max |
20 A
|
20 A
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Qualification Status |
Qualified
|
|
| Reference Standard |
MIL-19500/304
|
MIL
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Reverse Recovery Time-Max |
0.2 µs
|
0.2 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN LEAD OVER NICKEL
|
MATTE TIN OVER NICKEL
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
5
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.80
|
| Forward Voltage-Max (VF) |
|
1.4 V
|
| Reverse Current-Max |
|
25 µA
|
|
|
|
Compare JAN1N3890R with alternatives
Compare 1N3890RE3 with alternatives