JAN1N6081
vs
1N6081E3
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROPAC INDUSTRIES INC
|
MICROSEMI CORP
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Application |
SUPER FAST SOFT RECOVERY
|
ULTRA FAST RECOVERY POWER
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
O-XALF-W2
|
O-LALF-W2
|
| Non-rep Pk Forward Current-Max |
175 A
|
175 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Output Current-Max |
2 A
|
12 A
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
150 V
|
|
| Reverse Recovery Time-Max |
0.03 µs
|
0.03 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
HERMETIC SEALED, GLASS, G, 2 PIN
|
| Additional Feature |
|
METALLURGICALLY BONDED, HIGH RELIABILITY
|
| Forward Voltage-Max (VF) |
|
1.5 V
|
| Operating Temperature-Max |
|
155 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Reverse Current-Max |
|
10 µA
|
|
|
|
Compare JAN1N6081 with alternatives
Compare 1N6081E3 with alternatives