JAN1N6642US
vs
JANS1N6642US
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
SURFACEMOUNT PACKAGE-2
|
SURFACEMOUNT PACKAGE-2
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
O-XELF-R2
|
O-XELF-R2
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Output Current-Max |
0.3 A
|
0.3 A
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500/578E
|
MIL-19500/578E
|
| Rep Pk Reverse Voltage-Max |
75 V
|
75 V
|
| Reverse Recovery Time-Max |
0.005 µs
|
0.005 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.70
|
| Samacsys Manufacturer |
|
Microsemi Corporation
|
| Forward Voltage-Max (VF) |
|
1.2 V
|
| Non-rep Pk Forward Current-Max |
|
2.5 A
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Reverse Current-Max |
|
0.5 µA
|
|
|
|
Compare JAN1N6642US with alternatives
Compare JANS1N6642US with alternatives