JAN1N914
vs
1N914153
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
AEROFLEX/METELICS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DO-35
|
|
| Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
O-LALF-W2
|
| Pin Count |
2
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JEDEC-95 Code |
DO-35
|
DO-35
|
| JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Output Current-Max |
0.075 A
|
0.075 A
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Power Dissipation-Max |
0.25 W
|
0.25 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500/116
|
|
| Rep Pk Reverse Voltage-Max |
75 V
|
100 V
|
| Reverse Recovery Time-Max |
0.005 µs
|
0.008 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Base Number Matches |
12
|
1
|
| Forward Voltage-Max (VF) |
|
1 V
|
| Non-rep Pk Forward Current-Max |
|
4 A
|
| Operating Temperature-Max |
|
175 °C
|
| Reverse Current-Max |
|
5 µA
|
|
|
|
Compare JAN1N914 with alternatives
Compare 1N914153 with alternatives