JAN1N968C-1 vs JANTX1N966C-1 feature comparison

JAN1N968C-1 Microchip Technology Inc

Buy Now Datasheet

JANTX1N966C-1 Cobham Semiconductor Solutions

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC AEROFLEX/METELICS INC
Package Description DO-35, 2 PIN
Reach Compliance Code compliant unknown
Factory Lead Time 20 Weeks
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 25 Ω
JEDEC-95 Code DO-204AH DO-204AH
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0
Knee Impedance-Max 750 Ω
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.48 W
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 20 V 16 V
Reverse Current-Max 0.5 µA
Reverse Test Voltage 15 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max 17.2 mV/°C
Voltage Tol-Max 2% 2%
Working Test Current 6.2 mA 7.8 mA
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8541.10.00.50
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare JAN1N968C-1 with alternatives

Compare JANTX1N966C-1 with alternatives