JAN2N6987
vs
JANS2N6987
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NEW ENGLAND SEMICONDUCTOR
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Collector Current-Max (IC) |
0.6 A
|
0.6 A
|
| Collector-Emitter Voltage-Max |
60 V
|
60 V
|
| DC Current Gain-Min (hFE) |
50
|
50
|
| JEDEC-95 Code |
TO-116
|
|
| JESD-30 Code |
R-XDIP-T14
|
R-GDIP-T14
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
14
|
14
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, GLASS-SEALED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Polarity/Channel Type |
PNP
|
PNP
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Reference Standard |
MIL-PRF-19500/558
|
MIL-PRF-19500/558
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
9
|
6
|
| Package Description |
|
HERMETIC SEALED, CERDIP-14
|
| HTS Code |
|
8541.10.00.80
|
| Factory Lead Time |
|
29 Weeks
|
| Configuration |
|
SEPARATE, 4 ELEMENTS
|
| Number of Elements |
|
4
|
| Operating Temperature-Max |
|
200 °C
|
|
|
|
Compare JANS2N6987 with alternatives