JANHCA1N821
vs
1N821ARL
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
HERMETIC SEALED, DIE-3
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
15 Ω
|
10 Ω
|
| JESD-30 Code |
S-XUUC-N3
|
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Package Body Material |
UNSPECIFIED
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
UNCASED CHIP
|
|
| Power Dissipation-Max |
0.5 W
|
0.25 W
|
| Qualification Status |
Qualified
|
|
| Reference Standard |
MIL-19500/159M
|
|
| Reference Voltage-Nom |
6.2 V
|
6.2 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
ZENER
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
NO LEAD
|
|
| Terminal Position |
UPPER
|
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
7.5 mA
|
7.5 mA
|
| Base Number Matches |
4
|
3
|
|
|
|
Compare JANHCA1N821 with alternatives