JANS1N3156-1
vs
1N3156
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS, SIMILAR TO DO-7, 2 PIN
HERMETICALLY SEALED, GLASS, DO-7, 2 PIN
Reach Compliance Code
compliant
unknown
Factory Lead Time
39 Weeks
Additional Feature
METALLURGICALLY BONDED
METALLURGICAL BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
DO-204AA
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/158P
Reference Voltage-Nom
8.4 V
8.4 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
0.168 mV/°C
0.168 mV/°C
Voltage Tol-Max
5%
4.76%
Base Number Matches
1
87
Pbfree Code
No
Part Package Code
DO-7
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Dynamic Impedance-Max
15 Ω
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Working Test Current
10 mA
Compare JANS1N3156-1 with alternatives
Compare 1N3156 with alternatives