JANS1N3156-1 vs 1N3156 feature comparison

JANS1N3156-1 Microchip Technology Inc

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1N3156 Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS, SIMILAR TO DO-7, 2 PIN HERMETICALLY SEALED, GLASS, DO-7, 2 PIN
Reach Compliance Code compliant unknown
Factory Lead Time 39 Weeks
Additional Feature METALLURGICALLY BONDED METALLURGICAL BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-35 DO-204AA
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500/158P
Reference Voltage-Nom 8.4 V 8.4 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max 0.168 mV/°C 0.168 mV/°C
Voltage Tol-Max 5% 4.76%
Base Number Matches 1 87
Pbfree Code No
Part Package Code DO-7
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
Dynamic Impedance-Max 15 Ω
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Working Test Current 10 mA

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