JANS1N5806
vs
1N5806E3
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SENSITRON SEMICONDUCTOR
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.80
|
|
| Factory Lead Time |
36 Weeks
|
24 Weeks
|
| Additional Feature |
HIGH RELIABILITY
|
HIGH RELIABILITY
|
| Application |
ULTRA FAST RECOVERY
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.875 V
|
0.875 V
|
| JESD-30 Code |
E-LALF-W2
|
O-LALF-W2
|
| Non-rep Pk Forward Current-Max |
35 A
|
35 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Output Current-Max |
2.5 A
|
1 A
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ELLIPTICAL
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Qualified
|
|
| Reference Standard |
MIL-19500
|
|
| Rep Pk Reverse Voltage-Max |
150 V
|
150 V
|
| Reverse Recovery Time-Max |
0.025 µs
|
0.025 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
10
|
2
|
| Samacsys Manufacturer |
|
Microchip
|
| JESD-609 Code |
|
e3
|
| Operating Temperature-Min |
|
-65 °C
|
| Technology |
|
AVALANCHE
|
| Terminal Finish |
|
MATTE TIN OVER NICKEL
|
|
|
|
Compare JANS1N5806 with alternatives
Compare 1N5806E3 with alternatives