JANS1N5811US
vs
1N5811USE3
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
SEMTECH CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HERMETIC SEALED PACKAGE-2
|
ROHS COMPLIANT, HERMETIC SEALED, GLASS, B, MELF-2
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.80
|
|
| Factory Lead Time |
36 Weeks
|
24 Weeks
|
| Additional Feature |
HIGH SURGE CAPABILITY
|
HIGH RELIABILITY
|
| Application |
SUPER FAST SOFT RECOVERY
|
ULTRA FAST RECOVERY
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.875 V
|
0.875 V
|
| JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
| Non-rep Pk Forward Current-Max |
125 A
|
125 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Output Current-Max |
6 A
|
3 A
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Power Dissipation-Max |
5 W
|
|
| Qualification Status |
Qualified
|
|
| Reference Standard |
MIL-19500/477
|
|
| Rep Pk Reverse Voltage-Max |
150 V
|
150 V
|
| Reverse Recovery Time-Max |
0.03 µs
|
0.03 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Base Number Matches |
9
|
2
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
Microchip
|
| JESD-609 Code |
|
e3
|
| Operating Temperature-Min |
|
-65 °C
|
| Reverse Current-Max |
|
5 µA
|
| Technology |
|
AVALANCHE
|
| Terminal Finish |
|
MATTE TIN OVER NICKEL
|
|
|
|
Compare JANS1N5811US with alternatives
Compare 1N5811USE3 with alternatives