JANS1N5819-1
vs
1N5819-1E3
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
COMPENSATED DEVICES INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HERMETIC SEALED PACKAGE-2
|
ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
|
| Reach Compliance Code |
unknown
|
compliant
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JEDEC-95 Code |
DO-41
|
DO-41
|
| JESD-30 Code |
O-XALF-W2
|
O-LALF-W2
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Output Current-Max |
1 A
|
1 A
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Qualification Status |
Not Qualified
|
|
| Reference Standard |
MIL-19500/586
|
MIL-STD-750
|
| Surface Mount |
NO
|
NO
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Base Number Matches |
6
|
2
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
24 Weeks
|
| Forward Voltage-Max (VF) |
|
0.49 V
|
| Non-rep Pk Forward Current-Max |
|
25 A
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Rep Pk Reverse Voltage-Max |
|
45 V
|
| Reverse Current-Max |
|
50 µA
|
| Reverse Test Voltage |
|
45 V
|
|
|
|
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