JANS1N6350CUS
vs
JANS1N6350CUS
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
DEFENSE LOGISTICS AGENCY
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HERMETIC SEALED, GLASS, B, MELF-2
|
HERMETIC SEALED, GLASS, B, MELF-2
|
Reach Compliance Code |
unknown
|
compliant
|
Additional Feature |
METALLURGICALLY BONDED, HIGH RELIABILITY
|
METALLURGICALLY BONDED, HIGH RELIABILITY
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Qualified
|
Qualified
|
Reference Standard |
MIL-19500/533
|
MIL-19500/533
|
Reference Voltage-Nom |
120 V
|
120 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Voltage Tol-Max |
2%
|
2%
|
Working Test Current |
1 mA
|
1 mA
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Factory Lead Time |
|
32 Weeks
|
Operating Temperature-Max |
|
175 °C
|
Operating Temperature-Min |
|
-65 °C
|
|
|
|