JANTX1N6642US vs JANS1N6642U feature comparison

JANTX1N6642US Microchip Technology Inc

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JANS1N6642U Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description SURFACEMOUNT PACKAGE-2 SURFACEMOUNT PACKAGE-2
Reach Compliance Code compliant not_compliant
Factory Lead Time 23 Weeks
Samacsys Manufacturer Microchip Microsemi Corporation
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 1.2 V
JESD-30 Code O-XELF-R2 O-XELF-R2
JESD-609 Code e0 e0
Non-rep Pk Forward Current-Max 2.5 A
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Output Current-Max 0.3 A 0.3 A
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500/578E MIL-19500/578E
Rep Pk Reverse Voltage-Max 75 V 75 V
Reverse Current-Max 0.5 µA
Reverse Recovery Time-Max 0.005 µs 0.005 µs
Surface Mount YES YES
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Base Number Matches 2 9
Pbfree Code No
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.70

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