JANTX1N6642US vs JANTXV1N6642 feature comparison

JANTX1N6642US Microchip Technology Inc

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JANTXV1N6642 Cobham Semiconductor Solutions

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Rohs Code No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC AEROFLEX/METELICS INC
Package Description SURFACEMOUNT PACKAGE-2 HERMETIC SEALED GLASS PACKAGE-2
Reach Compliance Code compliant unknown
Factory Lead Time 23 Weeks
Samacsys Manufacturer Microchip
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 1.2 V
JESD-30 Code O-XELF-R2 O-LALF-W2
JESD-609 Code e0 e0
Non-rep Pk Forward Current-Max 2.5 A
Number of Elements 1 1
Number of Phases 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Output Current-Max 0.3 A 0.3 A
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500/578E MIL-19500/578
Rep Pk Reverse Voltage-Max 75 V 75 V
Reverse Current-Max 0.5 µA
Reverse Recovery Time-Max 0.005 µs 0.005 µs
Surface Mount YES NO
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Base Number Matches 2 9
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.70
Power Dissipation-Max 0.75 W

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Compare JANTXV1N6642 with alternatives