JANTX1N756A vs 1N756 feature comparison

JANTX1N756A MACOM

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1N756 Microchip Technology Inc

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Part Life Cycle Code Transferred Active
Ihs Manufacturer M/A-COM TECHNOLOGY SOLUTIONS INC MICROCHIP TECHNOLOGY INC
Package Description HERMETIC SEALED PACKAGE-2 HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-35 DO-35
JESD-30 Code O-PALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material PLASTIC/EPOXY GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/127
Reference Voltage-Nom 8.2 V 8.2 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 10%
Working Test Current 20 mA 20 mA
Base Number Matches 4 36
Rohs Code No
Factory Lead Time 14 Weeks
Additional Feature METALLURGICALLY BONDED
Dynamic Impedance-Max 8 Ω
Moisture Sensitivity Level 1
Operating Temperature-Max 175 °C

Compare JANTX1N756A with alternatives

Compare 1N756 with alternatives