JANTX1N964C-1
vs
BZT52H-C13,115
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
NXP SEMICONDUCTORS
|
Reach Compliance Code |
unknown
|
compliant
|
Additional Feature |
METALLURGICALLY BONDED
|
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JEDEC-95 Code |
DO-204AH
|
|
JESD-30 Code |
O-LALF-W2
|
R-PDSO-F2
|
JESD-609 Code |
e0
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
Package Shape |
ROUND
|
RECTANGULAR
|
Package Style |
LONG FORM
|
SMALL OUTLINE
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.48 W
|
0.375 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
13 V
|
13.25 V
|
Surface Mount |
NO
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
TIN
|
Terminal Form |
WIRE
|
FLAT
|
Terminal Position |
AXIAL
|
DUAL
|
Voltage Tol-Max |
2%
|
6.42%
|
Working Test Current |
9.5 mA
|
5 mA
|
Base Number Matches |
8
|
2
|
Part Package Code |
|
SOD-123
|
Package Description |
|
PLASTIC PACKAGE-2
|
Pin Count |
|
2
|
Manufacturer Package Code |
|
SOD123F
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.50
|
Factory Lead Time |
|
4 Weeks
|
Dynamic Impedance-Max |
|
110 Ω
|
Operating Temperature-Max |
|
150 °C
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BZT52H-C13,115 with alternatives
-
BZT52H-C13,115 vs BZT52H-C13,135
-
BZT52H-C13,115 vs BZT52H-C13
-
BZT52H-C13,115 vs 1N5243B
-
BZT52H-C13,115 vs MMSZ5243BT1
-
BZT52H-C13,115 vs JAN1N964D-1
-
BZT52H-C13,115 vs JAN1N964C-1
-
BZT52H-C13,115 vs MMSZ5243BT3
-
BZT52H-C13,115 vs MMSZ4700-VT/R7
-
BZT52H-C13,115 vs ZMM5243B-GT1