JANTX1N968CUR-1 vs JAN1N968CUR-1 feature comparison

JANTX1N968CUR-1 Microchip Technology Inc

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JAN1N968CUR-1 Cobham Semiconductor Solutions

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Rohs Code No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC AEROFLEX/METELICS INC
Reach Compliance Code compliant unknown
Factory Lead Time 20 Weeks
Additional Feature METALLURGICALLY BONDED, HIGH RELIABILITY METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AA DO-213AA
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Qualified Not Qualified
Reference Voltage-Nom 20 V 20 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 2% 2%
Working Test Current 6.2 mA 6.2 mA
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8541.10.00.50
Moisture Sensitivity Level NOT SPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare JANTX1N968CUR-1 with alternatives

Compare JAN1N968CUR-1 with alternatives