JANTXV1N4153UR-1
vs
1N4153UR-1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
| Application |
GENERAL PURPOSE
|
|
| Breakdown Voltage-Min |
100 V
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.88 V
|
|
| JEDEC-95 Code |
DO-213AA
|
DO-213AA
|
| JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
| JESD-609 Code |
e0
|
e0
|
| Non-rep Pk Forward Current-Max |
2 A
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Output Current-Max |
0.2 A
|
0.15 A
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Reference Standard |
MIL-PRF-19500
|
|
| Rep Pk Reverse Voltage-Max |
75 V
|
50 V
|
| Reverse Current-Max |
0.05 µA
|
|
| Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
| Reverse Test Voltage |
50 V
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Base Number Matches |
1
|
5
|
| Package Description |
|
HERMETIC SEALED, GLASS, LL34, MELF-2
|
| Factory Lead Time |
|
22 Weeks
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare JANTXV1N4153UR-1 with alternatives
Compare 1N4153UR-1 with alternatives