JANTXV1N5711UR-1
vs
CDLL5711-E3/TR
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
HERMETIC SEALED, LEADLESS, GLASS, LL34, MELF-2
|
HERMETIC SEALED, LEADLESS, GLASS, LL34, MELF-2
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
45 Weeks, 3 Days
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
HIGH RELIABILITY
|
METALLURGICALLY BONDED
|
| Application |
GENERAL PURPOSE
|
|
| Breakdown Voltage-Min |
70 V
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1 V
|
|
| JEDEC-95 Code |
DO-213AA
|
DO-213AA
|
| JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Output Current-Max |
0.033 A
|
0.033 A
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Qualification Status |
Qualified
|
|
| Reference Standard |
MIL-STD-750; MIL-PRF-19500
|
|
| Rep Pk Reverse Voltage-Max |
50 V
|
|
| Reverse Current-Max |
0.2 µA
|
|
| Reverse Test Voltage |
50 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.70
|
|
|
|
Compare JANTXV1N5711UR-1 with alternatives
Compare CDLL5711-E3/TR with alternatives