JANTXV1N5819-1
vs
EG1Z
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
EIC SEMICONDUCTOR CO LTD
|
| Part Package Code |
DO-41
|
|
| Package Description |
HERMETIC SEALED PACKAGE-2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
|
| Samacsys Manufacturer |
Microsemi Corporation
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
RECTIFIER DIODE
|
|
| JEDEC-95 Code |
DO-41
|
|
| JESD-30 Code |
O-XALF-W2
|
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
|
| Number of Phases |
1
|
|
| Number of Terminals |
2
|
|
| Output Current-Max |
1 A
|
|
| Package Body Material |
UNSPECIFIED
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Qualification Status |
Not Qualified
|
|
| Reference Standard |
MIL-19500/586
|
|
| Rep Pk Reverse Voltage-Max |
45 V
|
|
| Surface Mount |
NO
|
|
| Technology |
SCHOTTKY
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
WIRE
|
|
| Terminal Position |
AXIAL
|
|
| Base Number Matches |
7
|
4
|
|
|
|
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