JANTXV1N6638U vs 1N6638U feature comparison

JANTXV1N6638U Cobham Semiconductor Solutions

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1N6638U Microsemi Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer AEROFLEX/METELICS INC MICROSEMI CORP
Package Description HERMETIC SEALED GLASS PACKAGE-2 HERMETIC SEALED, GLASS, D-5D, 2 PIN
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
JESD-30 Code O-LALF-W2 O-LELF-R2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Output Current-Max 0.3 A 0.3 A
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/578
Rep Pk Reverse Voltage-Max 125 V 125 V
Reverse Recovery Time-Max 0.0045 µs 0.0045 µs
Surface Mount NO YES
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WRAP AROUND
Terminal Position AXIAL END
Base Number Matches 2 13
Pbfree Code No
Rohs Code No
Additional Feature METALLURGICALLY BONDED
Forward Voltage-Max (VF) 1.1 V
Non-rep Pk Forward Current-Max 2.5 A
Number of Phases 1
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Power Dissipation-Max 0.75 W
Reverse Current-Max 0.5 µA

Compare JANTXV1N6638U with alternatives

Compare 1N6638U with alternatives