JANTXV1N6638U vs JANS1N6638US feature comparison

JANTXV1N6638U Cobham Semiconductor Solutions

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JANS1N6638US Microsemi Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer AEROFLEX/METELICS INC MICROSEMI CORP
Package Description HERMETIC SEALED GLASS PACKAGE-2 SURFACEMOUNT PACKAGE-2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
JESD-30 Code O-LALF-W2 O-XELF-R2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Output Current-Max 0.3 A 0.3 A
Package Body Material GLASS UNSPECIFIED
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/578 MIL-19500/578E
Rep Pk Reverse Voltage-Max 125 V 125 V
Reverse Recovery Time-Max 0.0045 µs 0.0045 µs
Surface Mount NO YES
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WRAP AROUND
Terminal Position AXIAL END
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
Samacsys Manufacturer Microsemi Corporation
Additional Feature METALLURGICALLY BONDED
Forward Voltage-Max (VF) 1.1 V
Non-rep Pk Forward Current-Max 2.5 A
Number of Phases 1
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Reverse Current-Max 0.5 µA

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