JM38510/29307BMC vs 5962-9318705HNA feature comparison

JM38510/29307BMC Micross Components

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5962-9318705HNA Cobham Advanced Electronic Solutions

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSS COMPONENTS AEROFLEX MICROELECTRONIC SOLUTIONS
Part Package Code DFP
Package Description DFP,
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code R-CDFP-F28 S-XPGA-P66
Length 18.285 mm
Memory Density 262144 bit 4194304 bit
Memory IC Type STANDARD SRAM SRAM MODULE
Memory Width 8 32
Number of Functions 1
Number of Terminals 28 66
Number of Words 32768 words 131072 words
Number of Words Code 32000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 128KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC
Package Code DFP PGA
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.97 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form FLAT PIN/PEG
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL PERPENDICULAR
Width 10.415 mm
Base Number Matches 1 3
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code PGA66,11X11
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.0116 A
Standby Voltage-Min 2 V
Supply Current-Max 0.6 mA
Terminal Finish Tin/Lead (Sn/Pb) - hot dipped

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