K3N6C1000F-GC100 vs MX23C3210MC-10 feature comparison

K3N6C1000F-GC100 Samsung Semiconductor

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MX23C3210MC-10 Macronix International Co Ltd

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MACRONIX INTERNATIONAL CO LTD
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP44,.63
Pin Count 44 44
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 100 ns 100 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G44 R-PDSO-G44
Length 28.5 mm 28.5 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.1 mm 3 mm
Supply Current-Max 0.05 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 12.6 mm 12.6 mm
Base Number Matches 1 1
Additional Feature CAN ALSO BE CONFIGURED AS 2M X 16
JESD-609 Code e0
Package Equivalence Code SOP44,.63
Standby Current-Max 0.0001 A
Terminal Finish TIN LEAD

Compare K3N6C1000F-GC100 with alternatives

Compare MX23C3210MC-10 with alternatives