K6F1616U6B-EF700 vs MB82D01161-85PBN feature comparison

K6F1616U6B-EF700 Samsung Semiconductor

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MB82D01161-85PBN FUJITSU Limited

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC FUJITSU LTD
Part Package Code BGA BGA
Package Description VFBGA, TFBGA, BGA48,6X8,30
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 85 ns
JESD-30 Code S-PBGA-B48 R-PBGA-B48
Length 7 mm 9 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type CACHE SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -30 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TFBGA
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.3 V 2.7 V
Supply Voltage-Min (Vsup) 2.7 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 7 mm 6 mm
Base Number Matches 1 2
Rohs Code No
Additional Feature ALSO OPERATES AT 2.7V TO 3.1V SUPPLY
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code BGA48,6X8,30
Standby Current-Max 0.0002 A
Supply Current-Max 0.025 mA
Terminal Finish TIN LEAD

Compare K6F1616U6B-EF700 with alternatives

Compare MB82D01161-85PBN with alternatives