K6T0808U1D-GF70 vs M5M5256DFP-70GI feature comparison

K6T0808U1D-GF70 Samsung Semiconductor

Buy Now Datasheet

M5M5256DFP-70GI Renesas Electronics Corporation

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP28,.45 0.450 INCH, SOP-28
Pin Count 28 28
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-G28 R-PDSO-G28
JESD-609 Code e0
Length 18.29 mm 17.5 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP28,.45 SOP28,.5
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm 2.4 mm
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.035 mA 0.045 mA
Supply Voltage-Max (Vsup) 3.3 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 8.38 mm 8.4 mm
Base Number Matches 1 1
Moisture Sensitivity Level 2
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 20

Compare K6T0808U1D-GF70 with alternatives

Compare M5M5256DFP-70GI with alternatives