K7B401825A-TC65
vs
CY7C1386FV25-250BGI
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
QFP
|
BGA
|
Package Description |
LQFP,
|
14 X 22 MM, 2.40 MM HEIGHT, BGA-119
|
Pin Count |
100
|
119
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Access Time-Max |
|
2.6 ns
|
Additional Feature |
|
PIPELINED ARCHITECTURE
|
JESD-30 Code |
|
R-PBGA-B119
|
JESD-609 Code |
|
e0
|
Length |
|
22 mm
|
Memory Density |
|
18874368 bit
|
Memory IC Type |
|
CACHE SRAM
|
Memory Width |
|
36
|
Number of Functions |
|
1
|
Number of Terminals |
|
119
|
Number of Words |
|
524288 words
|
Number of Words Code |
|
512000
|
Operating Mode |
|
SYNCHRONOUS
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
512KX36
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
BGA
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
GRID ARRAY
|
Parallel/Serial |
|
PARALLEL
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
2.4 mm
|
Supply Voltage-Max (Vsup) |
|
2.625 V
|
Supply Voltage-Min (Vsup) |
|
2.375 V
|
Supply Voltage-Nom (Vsup) |
|
2.5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
14 mm
|
|
|
|
Compare K7B401825A-TC65 with alternatives
Compare CY7C1386FV25-250BGI with alternatives