KA741
vs
LM741CN/NOPB
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
0.300 INCH, DIP-8
|
DIP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.8 µA
|
0.8 µA
|
| Bias Current-Max (IIB) @25C |
0.5 µA
|
0.5 µA
|
| Common-mode Reject Ratio-Nom |
90 dB
|
90 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
7500 µV
|
7500 µV
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| Length |
9.2 mm
|
9.8171 mm
|
| Low-Offset |
NO
|
NO
|
| Neg Supply Voltage Limit-Max |
-18 V
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Slew Rate-Nom |
0.5 V/us
|
0.5 V/us
|
| Supply Current-Max |
2.8 mA
|
2.8 mA
|
| Supply Voltage Limit-Max |
18 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Gain-Min |
15000
|
15000
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
3
|
2
|
| Rohs Code |
|
Yes
|
| Common-mode Reject Ratio-Min |
|
70 dB
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Unity Gain BW-Nom |
|
1500
|
|
|
|
Compare KA741 with alternatives
Compare LM741CN/NOPB with alternatives