KC80524KX300256 vs KC80524KX333256 feature comparison

KC80524KX300256 Intel Corporation

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KC80524KX333256 Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP ROCHESTER ELECTRONICS INC
Part Package Code BGA BGA
Package Description BGA, BGA615,24X26,50 BGA,
Pin Count 615 615
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 36 36
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 66.67 MHz
External Data Bus Width 64 64
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code R-PBGA-B615 R-PBGA-B615
JESD-609 Code e0 e0
Length 35 mm 35 mm
Low Power Mode YES YES
Number of Terminals 615 615
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA615,24X26,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 2.79 mm 2.79 mm
Speed 300 MHz 333 MHz
Supply Voltage-Max 1.735 V 1.735 V
Supply Voltage-Min 1.465 V 1.465 V
Supply Voltage-Nom 1.6 V 1.6 V
Surface Mount YES YES
Technology CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 31 mm 31 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 2
Pbfree Code No
Moisture Sensitivity Level NOT SPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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