KDINTEL386DX25
vs
TSX68020MF116
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
TELEDYNE E2V (UK) LTD
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
BQFP,
|
QFP,
|
| Pin Count |
132
|
132
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A001.A.2.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
DYNAMIC DATA BUS SIZING; EMULATION HARDWARE; BARREL SHIFTER; NUMERIC COPROCESSOR INTERFACE
|
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
50 MHz
|
16.67 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-PQFP-G132
|
S-CQFP-G132
|
| Length |
24.13 mm
|
24.13 mm
|
| Low Power Mode |
NO
|
YES
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
2
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
132
|
132
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
100 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BQFP
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, BUMPER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
4.32 mm
|
3.43 mm
|
| Speed |
25 MHz
|
16.67 MHz
|
| Supply Current-Max |
320 mA
|
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24.13 mm
|
24.13 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare KDINTEL386DX25 with alternatives
Compare TSX68020MF116 with alternatives