KM62256BLI-7L vs HY62256ALP-70I feature comparison

KM62256BLI-7L Samsung Semiconductor

Buy Now Datasheet

HY62256ALP-70I SK Hynix Inc

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SK HYNIX INC
Package Description DIP, DIP, DIP28,.6
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
JESD-30 Code R-PDIP-T R-PDIP-T28
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
Part Package Code DIP
Pin Count 28
Additional Feature BATTERY BACKUP
I/O Type COMMON
JESD-609 Code e0
Length 37 mm
Number of Ports 1
Number of Terminals 28
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE
Output Enable YES
Package Equivalence Code DIP28,.6
Seated Height-Max 4.826 mm
Standby Current-Max 0.00005 A
Standby Voltage-Min 2 V
Supply Current-Max 0.07 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare KM62256BLI-7L with alternatives

Compare HY62256ALP-70I with alternatives