KM68FS1000ZI-10
vs
HY62QF8100CSLF-I-70
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SK HYNIX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
VFBGA,
|
TFBGA,
|
Pin Count |
48
|
48
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
100 ns
|
70 ns
|
JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B48
|
Length |
8 mm
|
6.3 mm
|
Memory Density |
1048576 bit
|
1048576 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
48
|
48
|
Number of Words |
131072 words
|
131072 words
|
Number of Words Code |
128000
|
128000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
128KX8
|
128KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
TFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.81 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
3.3 V
|
2.7 V
|
Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.75 mm
|
0.75 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
6 mm
|
6.2 mm
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e1
|
Supply Voltage-Nom (Vsup) |
|
2.5 V
|
Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare KM68FS1000ZI-10 with alternatives
Compare HY62QF8100CSLF-I-70 with alternatives