KMPC8250ACVRIHBC
vs
MPC8280ZQPX
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
27 X 27 MM, PLASTIC, BGA-516
|
27 X 27 MM, 2.25 MM, 1 MM PITCH, PLASTIC, BGA-516
|
| Pin Count |
516
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
5A991
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B516
|
S-PBGA-B516
|
| JESD-609 Code |
e1
|
|
| Length |
27 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
516
|
516
|
| Operating Temperature-Max |
70 °C
|
105 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA516,26X26,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.55 mm
|
2.55 mm
|
| Speed |
200 MHz
|
300 MHz
|
| Supply Voltage-Max |
1.9 V
|
1.6 V
|
| Supply Voltage-Min |
1.7 V
|
1.45 V
|
| Supply Voltage-Nom |
1.8 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
27 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Clock Frequency-Max |
|
66 MHz
|
| Low Power Mode |
|
NO
|
|
|
|
Compare KMPC8250ACVRIHBC with alternatives
Compare MPC8280ZQPX with alternatives