KMPC8250AVRIHBC
vs
MPC8306VMADDCA
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
BGA, BGA516,26X26,40
|
19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369
|
Pin Count |
516
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
External Data Bus Width |
64
|
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B516
|
S-PBGA-B369
|
Length |
27 mm
|
19 mm
|
Number of Terminals |
516
|
369
|
Operating Temperature-Max |
70 °C
|
105 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LFBGA
|
Package Equivalence Code |
BGA516,26X26,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.55 mm
|
1.61 mm
|
Speed |
200 MHz
|
266 MHz
|
Supply Voltage-Max |
1.9 V
|
|
Supply Voltage-Min |
1.7 V
|
|
Supply Voltage-Nom |
1.8 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
19 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
ECCN Code |
|
3A991.A.2
|
Factory Lead Time |
|
4 Weeks
|
Samacsys Manufacturer |
|
NXP
|
Clock Frequency-Max |
|
66.67 MHz
|
JESD-609 Code |
|
e2
|
Low Power Mode |
|
YES
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
Tin/Silver (Sn/Ag)
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare KMPC8250AVRIHBC with alternatives
Compare MPC8306VMADDCA with alternatives