KSZ8001L
vs
MCP2542FDT-E/MNY
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
LEAD FREE, LQFP-48
|
HVSON,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8517.70.00.00
|
8542.39.00.01
|
| Factory Lead Time |
32 Weeks, 4 Days
|
4 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Data Rate |
100000 Mbps
|
8000 Mbps
|
| JESD-30 Code |
S-PQFP-G48
|
R-PDSO-N8
|
| JESD-609 Code |
e3
|
e4
|
| Length |
7 mm
|
3 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
8
|
| Number of Transceivers |
1
|
1
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
HVSON
|
| Package Equivalence Code |
QFP48,.35SQ,20
|
SOLCC8,.12,20
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.6 mm
|
0.8 mm
|
| Supply Voltage-Nom |
1.8 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
CAN FD TRANSCEIVER
|
| Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
7 mm
|
2 mm
|
| Base Number Matches |
5
|
1
|
| Date Of Intro |
|
2016-03-03
|
| Supply Current-Max |
|
140 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare KSZ8001L with alternatives
Compare MCP2542FDT-E/MNY with alternatives