KSZ8864CNXI-TR
vs
KSZ8864RMNUB
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFN-64
|
QFN-64
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
5A991.B.1
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
10 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Additional Feature |
SEATED HT-CALCULATED
|
SEATED HT-CALCULATED
|
| JESD-30 Code |
S-XQCC-N64
|
S-XQCC-N64
|
| JESD-609 Code |
e3
|
e3
|
| Length |
8 mm
|
8 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC64,.32SQ,16
|
LCC64,.32SQ,16
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Screening Level |
TS 16949
|
AEC-Q100; TS 16949
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET SWITCH
|
ETHERNET SWITCH
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
1
|
4
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare KSZ8864CNXI-TR with alternatives
Compare KSZ8864RMNUB with alternatives