KSZ9031RNXIC-TR
vs
BCM53158XUB1KFBG
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
BROADCOM INC
|
| Package Description |
QFN-48
|
LFBGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
17 Weeks, 4 Days
|
50 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Avago Technologies
|
| Data Rate |
1000000 Mbps
|
|
| JESD-30 Code |
S-XQCC-N48
|
S-PBGA-B311
|
| JESD-609 Code |
e3
|
e1
|
| Length |
7 mm
|
13 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
311
|
| Number of Transceivers |
1
|
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
LFBGA
|
| Package Equivalence Code |
LCC48,.27SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
0.9 mm
|
1.337 mm
|
| Supply Voltage-Nom |
1.2 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7 mm
|
13 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare KSZ9031RNXIC-TR with alternatives
Compare BCM53158XUB1KFBG with alternatives