L9337MD
vs
L9338MD
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP, SOP20,.4
|
SOP-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Built-in Protections |
OVER CURRENT; THERMAL
|
TRANSIENT; OVER CURRENT; THERMAL
|
| Driver Number of Bits |
3
|
4
|
| Interface IC Type |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| JESD-609 Code |
e4
|
e4
|
| Length |
12.8 mm
|
12.8 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
3
|
4
|
| Number of Terminals |
20
|
20
|
| Output Current Flow Direction |
SINK
|
SINK
|
| Output Peak Current Limit-Nom |
0.7 A
|
0.7 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP20,.4
|
SOP20,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Supply Voltage-Max |
32 V
|
32 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
14 V
|
14 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BCDMOS
|
BCD
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Turn-off Time |
4.5 µs
|
4.5 µs
|
| Turn-on Time |
3.5 µs
|
3.5 µs
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
2
|
4
|
| Pbfree Code |
|
Yes
|
| Output Current-Max |
|
0.3 A
|
|
|
|
Compare L9337MD with alternatives
Compare L9338MD with alternatives