LAN9353TI/PT
vs
VSC8486SN
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
HTFQFP,
|
BGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
8 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| JESD-30 Code |
S-PQFP-G64
|
S-PBGA-B256
|
| JESD-609 Code |
e3
|
|
| Length |
10 mm
|
17 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
256
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTFQFP
|
BGA
|
| Package Equivalence Code |
PQFP64,.48SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1.2 mm
|
3.22 mm
|
| Supply Voltage-Nom |
3.3 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET SWITCH
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
10 mm
|
17 mm
|
| Base Number Matches |
1
|
2
|
| Date Of Intro |
|
2017-02-13
|
|
|
|
Compare LAN9353TI/PT with alternatives
Compare VSC8486SN with alternatives