LCMXO640E-3FN256C vs LCMXO640E-3F256I feature comparison

LCMXO640E-3FN256C Lattice Semiconductor Corporation

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LCMXO640E-3F256I Lattice Semiconductor Corporation

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description 17 X 17 MM, ROHS COMPLIANT, FPBGA-256 17 X 17 MM, FPBGA-256
Pin Count 256 256
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 388 MHz 388 MHz
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 7 7
Number of I/O Lines 159 159
Number of Inputs 159 159
Number of Logic Cells 640 640
Number of Outputs 159 159
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 7 DEDICATED INPUTS, 159 I/O 7 DEDICATED INPUTS, 159 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 4.9 ns 4.9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 2.1 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 17 mm 17 mm
Base Number Matches 1 1

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