LCMXO640E-3FN256C
vs
LCMXO640E-3F256I
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
17 X 17 MM, ROHS COMPLIANT, FPBGA-256
|
17 X 17 MM, FPBGA-256
|
Pin Count |
256
|
256
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
388 MHz
|
388 MHz
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e1
|
e0
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Dedicated Inputs |
7
|
7
|
Number of I/O Lines |
159
|
159
|
Number of Inputs |
159
|
159
|
Number of Logic Cells |
640
|
640
|
Number of Outputs |
159
|
159
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
7 DEDICATED INPUTS, 159 I/O
|
7 DEDICATED INPUTS, 159 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
250
|
225
|
Programmable Logic Type |
FLASH PLD
|
FLASH PLD
|
Propagation Delay |
4.9 ns
|
4.9 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.1 mm
|
2.1 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare LCMXO640E-3FN256C with alternatives
Compare LCMXO640E-3F256I with alternatives