LD27128 vs AM27C128-250DC feature comparison

LD27128 Intel Corporation

Buy Now Datasheet

AM27C128-250DC Rochester Electronics LLC

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer INTEL CORP ROCHESTER ELECTRONICS LLC
Part Package Code DIP
Package Description HERMETIC SEALED, CERAMIC, DIP-28 DIP,
Pin Count 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 250 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28 R-GDIP-T28
JESD-609 Code e0
Length 37.084 mm 37.1475 mm
Memory Density 131072 bit 131072 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 16KX8 16KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 21 V
Qualification Status Not Qualified
Seated Height-Max 5.08 mm 5.588 mm
Supply Current-Max 0.14 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 2

Compare LD27128 with alternatives