LD27128 vs DE27128-25 feature comparison

LD27128 Intel Corporation

Buy Now Datasheet

DE27128-25 LSI Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP SEEQ TECHNOLOGY INC
Part Package Code DIP
Package Description HERMETIC SEALED, CERAMIC, DIP-28 DIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 250 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Length 37.084 mm
Memory Density 131072 bit 131072 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16KX8 16KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 21 V 21 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.14 mA 0.12 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS NMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 1
Additional Feature 21V PROGRAMMING VOLTAGE

Compare LD27128 with alternatives

Compare DE27128-25 with alternatives