LD3985J15
vs
FAN2560UC15X
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
FAIRCHILD SEMICONDUCTOR CORP
|
Part Package Code |
FLIP-CHIP
|
CSP
|
Package Description |
VFBGA, BGA5,3X3,17/10
|
VFBGA, BGA5,3X3,17/10
|
Pin Count |
5
|
5
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.31.00.01
|
Adjustability |
FIXED
|
FIXED
|
Dropout Voltage1-Max |
0.1 V
|
0.2 V
|
Dropout Voltage1-Nom |
0.06 V
|
0.07 V
|
Input Voltage Absolute-Max |
6 V
|
5.5 V
|
Input Voltage-Max |
6 V
|
5.5 V
|
Input Voltage-Min |
2.5 V
|
1.7 V
|
JESD-30 Code |
R-PBGA-B5
|
R-PBGA-B5
|
Length |
1.54 mm
|
1.33 mm
|
Line Regulation-Max |
0.00525%
|
|
Load Regulation-Max |
0.0179%
|
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
1
|
Number of Terminals |
5
|
5
|
Operating Temperature TJ-Max |
125 °C
|
125 °C
|
Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
Output Current1-Max |
0.15 A
|
0.35 A
|
Output Voltage1-Max |
1.575 V
|
1.53 V
|
Output Voltage1-Min |
1.425 V
|
1.47 V
|
Output Voltage1-Nom |
1.5 V
|
1.5 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA5,3X3,17/10
|
BGA5,3X3,17/10
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
Seated Height-Max |
0.965 mm
|
0.625 mm
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Voltage Tolerance-Max |
5%
|
2%
|
Width |
1.19 mm
|
0.96 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Manufacturer Package Code |
|
5BALL WL-CSP, 2X2 ARRAY WITH CENTER BALL, 0.5MM PITCH, 300UM BALL
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
1
|
Packing Method |
|
TR
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
TIN SILVER COPPER
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare LD3985J15 with alternatives
Compare FAN2560UC15X with alternatives