LFE2M50SE-6FN900C
vs
ORSPI4-2FN1156I
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
FPBGA-900
|
35 X 35 MM, LEAD FREE, FPBGA-1156
|
Pin Count |
900
|
1156
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
3A991.D
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
357 MHz
|
185 MHz
|
Combinatorial Delay of a CLB-Max |
0.331 ns
|
|
JESD-30 Code |
S-PBGA-B900
|
S-PBGA-B1156
|
JESD-609 Code |
e1
|
e1
|
Length |
31 mm
|
35 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
6000
|
2024
|
Number of Inputs |
410
|
|
Number of Logic Cells |
50000
|
|
Number of Outputs |
410
|
|
Number of Terminals |
900
|
1156
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA900,30X30,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
250
|
250
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.6 mm
|
2.6 mm
|
Supply Voltage-Max |
1.26 V
|
3.6 V
|
Supply Voltage-Min |
1.14 V
|
3 V
|
Supply Voltage-Nom |
1.2 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
OTHER
|
AUTOMOTIVE
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
31 mm
|
35 mm
|
Base Number Matches |
1
|
1
|
Number of Equivalent Gates |
|
471000
|
Organization |
|
2024 CLBS, 471000 GATES
|
|
|
|
Compare LFE2M50SE-6FN900C with alternatives
Compare ORSPI4-2FN1156I with alternatives