LH79520N0Q000B1;55
vs
LH79520N0Q000B1,55
feature comparison
Part Life Cycle Code |
End Of Life
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFP
|
QFP
|
Package Description |
20 X 20 MM, 1.40 MM HEIGHT, SOT1017-1, LQFP-176
|
20 X 20 MM, 1.40 MM HEIGHT, SOT1017-1, LQFP-176
|
Pin Count |
176
|
176
|
Manufacturer Package Code |
SOT1017-1
|
SOT1017-1
|
Reach Compliance Code |
compliant
|
unknown
|
Samacsys Manufacturer |
NXP
|
|
Has ADC |
NO
|
NO
|
Address Bus Width |
|
|
Bit Size |
32
|
32
|
Clock Frequency-Max |
0.032 MHz
|
0.032 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQFP-G176
|
S-PQFP-G176
|
JESD-609 Code |
e2
|
e3
|
Length |
20 mm
|
20 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
176
|
176
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LFQFP
|
Package Equivalence Code |
QFP176,.87SQ,16
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
250
|
|
Power Supplies |
1.8,3.3 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Speed |
77.4144 MHz
|
77.4144 MHz
|
Supply Voltage-Max |
1.98 V
|
1.98 V
|
Supply Voltage-Min |
1.62 V
|
1.62 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Silver (Sn/Ag)
|
TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
20 mm
|
20 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
Yes
|
HTS Code |
|
8542.31.00.01
|
Technology |
|
CMOS
|
|
|
|