LM10524TMX-A/NOPB
vs
ISL9230IRZ-T13
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
INTERSIL CORP
|
Package Description |
DSBGA-46
|
HVQCCN,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Adjustable Threshold |
YES
|
YES
|
Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
Input Voltage-Max |
5.5 V
|
|
Input Voltage-Min |
3 V
|
|
JESD-30 Code |
R-PBGA-B46
|
S-PQCC-N16
|
JESD-609 Code |
e1
|
e3
|
Length |
3.21 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
3
|
Number of Channels |
3
|
1
|
Number of Functions |
1
|
1
|
Number of Outputs |
3
|
|
Number of Terminals |
46
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-30 °C
|
-40 °C
|
Output Current-Max |
2.5 A
|
|
Output Voltage-Max |
3.6 V
|
|
Output Voltage-Min |
0.7 V
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
HVQCCN
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.675 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
6.25 V
|
Supply Voltage-Min (Vsup) |
3 V
|
4.3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Switching Frequency-Max |
2300 kHz
|
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
MATTE TIN
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
2.81 mm
|
3 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare LM10524TMX-A/NOPB with alternatives