LM108AN
vs
LM108AD
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SIGNETICS CORP
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
,
|
HERMETIC SEALED, DIP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| JESD-30 Code |
R-PDIP-T8
|
R-CDIP-T8
|
| Neg Supply Voltage Limit-Max |
-20 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-20 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage Limit-Max |
20 V
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
20 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
4
|
| Rohs Code |
|
No
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
|
0.003 µA
|
| Common-mode Reject Ratio-Nom |
|
110 dB
|
| Frequency Compensation |
|
NO
|
| Input Offset Voltage-Max |
|
1000 µV
|
| JESD-609 Code |
|
e0
|
| Length |
|
9.779 mm
|
| Low-Offset |
|
NO
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP14,.3
|
| Screening Level |
|
MIL-STD-883 Class C
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Current-Max |
|
0.6 mA
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
7.62 mm
|
|
|
|
Compare LM108AN with alternatives
Compare LM108AD with alternatives